Cindy Ding

City:

Tianjin

Country:

Taiwan

Published Applications:

Last publication date:

2005-10-13

Recent patent applications by Ding Cindy

Cindy Ding from Tianjin, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Lead frame having a tilt flap for locking molding compound and semiconductor device having the same

Top finger having a groove and semiconductor device having the same

InventorID:

4921603 ⎘