Boise, Idaho
United States
9
2020-12-03
The entities that hold a legal rights for patent applications filed by inventor Ray Dewali:
Dewali Ray from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor structure patterning
#2 | 2020-07-30Formation of a capacitor using a sacrificial layer
#3 | 2016-03-24Pass-through interconnect structure for microelectronic dies and associated systems and methods
#4 | 2013-10-24Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
#5 | 2012-04-19Pass-through 3D interconnect for microelectronic dies and associated systems and methods
#6 | 2011-10-20Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
#7 | 2009-07-02Pass-through 3D interconnect for microelectronic dies and associated systems and methods
#8 | 2009-01-29Wafer Bonding Using Nanoparticle Material
#9 | 2009-01-22Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
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