Daniel E. Bufanda

City:

Burlington, Connecticut

Country:

United States

Published Applications:

Last publication date:

2005-10-18

Top Assignees for applications by Daniel E. Bufanda

The entities that hold a legal rights for patent applications filed by inventor Bufanda Daniel E.:

RADIO FREQUENCY SYSTEMS, INC. 1 Meriden, CT United States

Recent patent applications by Bufanda Daniel E.

Daniel E. Bufanda from Burlington, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2005-10-18

US10197570

Microcellular foam dielectric for use in transmission lines

#2 | 2005-10-06

US20050222283A1

Chemistry; metallurgy

Microcellular foam dielectric for use in transmission lines

InventorID:

4924112 ⎘