Daniel M. KINZER

FULL DUPLEX DIGITAL ISOLATOR

SIGNAL ISOLATOR WITH MODULATOR CIRCUIT AND METHOD OF OPERATING THE SAME

CIRCUITS AND METHODS FOR CONTROLLING A VOLTAGE OF A SEMICONDUCTOR SUBSTRATE

CIRCUITS AND METHODS FOR GENERATING BIAS VOLTAGES IN SUBSTRATE CLAMP CIRCUITS

INTEGRATED POWER DEVICE WITH ENERGY HARVESTING GATE DRIVER

CIRCUITS AND METHODS FOR CONTROLLING A VOLTAGE OF A SEMICONDUCTOR SUBSTRATE

INTEGRATED BIDIRECTIONAL FOUR QUADRANT SWITCHES WITH DRIVERS AND INPUT/OUTPUT CIRCUITS

TRANSISTOR DV/DT CONTROL CIRCUIT

HALF-BRIDGE CIRCUIT USING MONOLITHIC FLIP-CHIP GAN POWER DEVICES

Integrated gallium nitride power device with protection circuits

INTEGRATED HALF-BRIDGE POWER CONVERTER

MONOLITHIC HIGH SIDE GALLIUM NITRIDE DEVICE WITH INTEGRATED CAPACITIVE LEVEL SHIFTER CIRCUITS

Circuits and methods for controlling a voltage of a semiconductor substrate

Half-bridge circuit using separately packaged GaN power devices

Pulsed level shift and inverter circuits for GaN devices

SYSTEM AND METHODS FOR SINGULATION OF GAN-ON-SILICON WAFERS

Integrated gallium nitride power device with protection circuits

Transistor DV/DT control circuit

Integrated power device with energy harvesting gate driver

Circuits and methods for controlling a voltage of a semiconductor substrate

Half-bridge circuit using GaN power devices

Half-bridge circuit using separately packaged GaN power devices

Half-bridge circuit using monolithic flip-chip GaN power devices

Half-bridge circuit using flip-chip GaN power devices

FIELD PLATE STRUCTURES FOR GAN HIGH VOLTAGE TRANSISTORS

Electronic packages with integral heat spreaders

Electronic packages with integral heat spreaders

Overcurrent protection based on zero current detection

Power transistor, a driver, and an overvoltage protection circuit

THERMALLY ENHANCED ELECTRONIC PACKAGES FOR GAN POWER INTEGRATED CIRCUITS

Integrated half-bridge power converter

Thermally enhanced electronic packages for GaN power integrated circuits

ACTIVE BRIDGE RECTIFIER

HALF BRIDGE CIRCUIT WITH BOOTSTRAP CAPACITOR CHARGING CIRCUIT

Power transistor with distributed gate

Pulsed level shift and inverter circuits for GaN devices

GaN circuit drivers for GaN circuit loads

Gallium nitride transistor with improved termination structure

Transistor structure with depletion-mode and enhancement mode-devices

Half bridge circuit with bootstrap capacitor charging circuit

Bidirectional GaN switch with built-in bias supply and integrated gate drivers

Half bridge power conversion circuits using GaN devices

INTEGRATED ESD PROTECTION CIRCUITS IN GAN

Pulsed level shift and inverter circuits for GaN devices

Leadless electronic packages for GaN devices

Electronic packages for flip chip devices

Zero voltage soft switching scheme for power converters

Zero voltage soft switching scheme for power converters

GaN structures

Pulsed level shift and inverter circuits for GaN devices

Level shift and inverter circuits for GaN devices

Half bridge driver circuits

Integrated level shifter

GaN circuit drivers for GaN circuit loads

Integrated bias supply, reference and bias current circuits for GaN devices

Half bridge power conversion circuits using GaN devices

Bootstrap capacitor charging circuit for GaN devices

POWER TRANSISTOR WITH DISTRIBUTED DIODES

Power transistor with distributed gate

GaN overvoltage protection circuit

Trench-based power semiconductor devices with increased breakdown voltage characteristics

Trench-based power semiconductor devices with increased breakdown voltage characteristics

Wafer level MOSFET metallization

Vertical MOSFET transistor having source/drain contacts disposed on the same side and method for manufacturing the same

Hybrid semiconductor device having a GaN transistor and a silicon MOSFET

LATERAL DRAIN MOSFET WITH SUBSTRATE DRAIN CONNECTION

LDMOS with self aligned vertical LDD backside drain

LDMOS with self aligned vertical LDD backside drain

Lateral MOSFET with substrate drain connection

Trench-based power semiconductor devices with increased breakdown voltage characteristics

SUPERJUNCTION POWER SEMICONDUCTOR DEVICE

P-channel trench MOSFET structure

III-nitride power semiconductor device

Monolithic MOSFET and Schottky diode device

III-nitride power semiconductor device

Copper-pillar plugs for semiconductor die

Hybrid semiconductor device

GaN SEMICONDUCTOR DEVICE AND PROCESS EMPLOYING GaN ON THIN SAPHIRE LAYER ON POLYCRYSTALLINE SILICON CARBIDE

Superjunction power semiconductor device

Termination structure for a power semiconductor device

Ultra thin FET

IGBT with injection regions between MOSFET cells

Voltage supply circuit including a III-nitride based power semiconductor device

III-nitride integrated schottky and power device

III-nitride power semiconductor device with a current sense electrode

Top drain MOSgated device and process of manufacture therefor

Chip-scale package

Termination design with multiple spiral trench rings

Trench MOSFET with trench tip implants

Top drain MOSFET

Common MOSFET process for plural devices

Integrated III-nitride power devices

III-nitride bidirectional switch

Current sense trench type MOSFET with improved accuracy and ESD withstand capability

Superjunction device and process for its manufacture

Process for counter doping N-type silicon in Schottky device Ti silicide barrier

Trench FET with non overlapping poly and remote contact therefor