Michael James Perpich

City:

Hackensack, New Jersey

Country:

United States

Published Applications:

Last publication date:

2005-12-01

Top Assignees for applications by Michael James Perpich

The entities that hold a legal rights for patent applications filed by inventor Perpich Michael James:

ECI Technology, Inc. 1 East Rutherford, NJ United States

Recent patent applications by Perpich Michael James

Michael James Perpich from Hackensack, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2005-12-01

US20050263399A1

Chemistry; metallurgy

Efficient analysis of organic additives in an acid copper plating bath

#2 | 2005-05-10

US10461652

Measurement of complexing agent concentration in an electroless plating bath

InventorID:

4951137 ⎘