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Inventor profile of:

Jack Tu

City:

Taichung County

Country:

Taiwan

Published Applications:

1

Last publication date:

2005-12-01

Recent patent applications by Tu Jack

Jack Tu from Taichung County, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2005-12-01

US20050266611A1

Flip chip packaging method and flip chip assembly thereof

InventorID:

4952826 ⎘