Anaheim, California
United States
90
2026-05-14
The entities that hold a legal rights for patent applications filed by inventor Chen Howard E.:
Howard E. Chen from Anaheim, US has applied for patents for these inventions. The list has both pending applications and granted patents:
ELECTRONIC PACKAGES AND ELECTRONIC DEVICES FOR MOUNTING TO A CIRCUIT BOARD
#2 | 2026-05-07DUAL-SIDED MOLD GRID ARRAY WITH A COPPER POST ISOLATION WALL AND METHOD OF FORMING SAME
#3 | 2026-04-09PACKAGED MODULE HAVING THIN SUBSTRATE
#4 | 2026-01-15ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING AN ELECTRONIC PACKAGE
#5 | 2025-09-25PACKAGED MODULES HAVING FILTER FAN OUT SUBSTRATE
#6 | 2025-07-31ELECTRONICS PACKAGE WITH SUBSTRATE RECESS AND CIRCUITRY COMPONENTS OVERHANGING THE SUBSTRATE RECESS
#7 | 2025-07-31ELECTRONICS PACKAGE WITH SUBSTRATE RECESS AND CIRCUITRY COMPONENTS INTERCONNECTED OVER THE SUBSTRATE RECESS
#8 | 2025-03-13DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES FOR SHIELDING APPLICATIONS
#9 | 2025-02-13SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY
#10 | 2024-12-05DEVICES, SYSTEMS AND METHODS RELATED TO DUAL-SIDED MODULES
#11 | 2024-10-17METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE
#12 | 2024-07-25METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOOTPRINT
#13 | 2024-07-18DEVICES, SYSTEMS AND METHODS FOR REDUCING WARPAGE DURING FABRICATION OF DUAL SIDE MOLD MODULES
#14 | 2023-12-28SHIELDED MODULE FABRICATION METHODS AND DEVICES
#15 | 2023-10-12DUAL-SIDED PACKAGED RADIO-FREQUENCY MODULE HAVING BALL GRID ARRAY EMBEDDED IN UNDERSIDE MOLDING
#16 | 2023-10-12DUAL-SIDED MOLDED PACKAGE WITH EXPOSED BACKSIDE DIE FOR THERMAL DISSIPATION
#17 | 2023-08-17ELECTRICAL PACKAGES WITH NON-LINEAR INTERCONNECT MEMBERS
#18 | 2023-07-06ELECTRICAL PACKAGES WITH ELONGATED INTERCONNECT MEMBERS
#19 | 2023-07-06MECHANICALLY REINFORCED ELECTRICAL PACKAGES
#20 | 2023-05-04DUAL SIDED MOLDED PACKAGE WITH VARYING INTERCONNECT PAD SIZES AND VARYING EXPOSED SOLDERABLE AREA
#21 | 2023-05-04DUAL SIDED MOLDED PACKAGE WITH VARYING INTERCONNECT PAD SIZES AND UNIFORM EXPOSED SOLDERABLE AREA
#22 | 2023-04-13Electronic Package and Method for Manufacturing an Electronic Package
#23 | 2022-10-20Devices and methods related to metallization of ceramic substrates for shielding applications
#24 | 2022-10-06MODULE HAVING DUAL SIDE MOLD WITH METAL POSTS
#25 | 2022-09-29Application of conductive via or trench for intra module EMI shielding
#26 | 2022-08-11Packaged module with ball grid array and grounding pins for signal isolation, method of manufacturing the same, and wireless device comprising the same
#27 | 2022-05-12Devices related to dual-sided module with land-grid array (LGA) footprint
#28 | 2022-04-14Devices and methods related to dual-sided radio-frequency package with overmold structure
#29 | 2021-05-13Control of under-fill using a film during fabrication for a dual-sided ball grid array package
#30 | 2021-02-11Methods related to metallization of ceramic substrates for shielding applications
#31 | 2020-10-08Dual-sided radio-frequency package with overmold structure
#32 | 2020-10-08MODULE WITH BALL GRID ARRAY HAVING INCREASED DIE AREA
#33 | 2020-07-16Apparatus related to conformal coating implemented with surface mount devices
#34 | 2020-07-16Methods related to dual-sided module with land-grid array (LGA) footprint
#35 | 2020-05-21DEVICES RELATED TO SHIELDED RADIO-FREQUENCY MODULES HAVING REDUCED AREA
#36 | 2020-05-21Methods and modules related to shielded lead frame packages
#37 | 2020-05-21METHODS RELATED TO THROUGH-MOLD OPENINGS FOR DUAL-SIDED PACKAGED MODULES WITH BALL GRID ARRAYS
#38 | 2019-07-11Devices for fabrication of shielded modules
#39 | 2019-06-27Semiconductor package having a metal paint layer
#40 | 2019-06-13Conformal shielding for a diversity receive module
#41 | 2019-06-06Radio frequency isolation structure
#42 | 2019-02-21Through-mold openings for dual-sided packaged modules with ball grid arrays
#43 | 2019-02-07Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the same
#44 | 2018-12-20Methods of determining racetrack layout for radio frequency isolation structure
#45 | 2018-11-01Methods and modules related to shielded lead frame packages
#46 | 2018-08-233-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES
#47 | 2018-08-23Dual-sided module with land-grid array (LGA) footprint
#48 | 2018-08-09CONTROLLED STANDOFF FOR MODULE WITH BALL GRID ARRAY
#49 | 2018-08-09CONTROL OF UNDER-FILL USING A FILM DURING FABRICATION FOR A DUAL-SIDED BALL GRID ARRAY PACKAGE
#50 | 2018-05-24Methods related to implementing surface mount devices with ground paths
#51 | 2018-04-05CIRCUITS AND METHODS RELATED TO RADIO-FREQUENCY DEVICES WITH OVERMOLD STRUCTURE
#52 | 2018-04-05RADIO-FREQUENCY DEVICE WITH DUAL-SIDED OVERMOLD STRUCTURE
#53 | 2018-04-05Dual-sided radio-frequency package with overmold structure
#54 | 2018-01-04Methods for forming shielded radio-frequency modules having reduced area
#55 | 2017-11-23Racetrack layout for radio frequency isolation structure
#56 | 2017-11-02Shielded diversity receive module
#57 | 2017-10-19Semiconductor package having a metal paint layer
#58 | 2017-08-17Shielded lead frame packages
#59 | 2017-05-25Devices and methods related to packaging of radio-frequency devices on ceramic substrates
#60 | 2017-04-27Devices and methods related to fabrication of shielded modules
#61 | 2017-02-09Apparatus and methods related to conformal coating implemented with surface mount devices
#62 | 2016-06-23Semiconductor package having a metal paint layer
#63 | 2016-06-09Radio frequency isolation structure with racetrack
#64 | 2016-06-09Racetrack layout for radio frequency shielding
#65 | 2016-04-07DUAL-SIDED RADIO-FREQUENCY PACKAGE HAVING BALL GRID ARRAY
#66 | 2016-03-31APPARATUS AND METHODS RELATED TO CERAMIC DEVICE EMBEDDED IN LAMINATE SUBSTRATE
#67 | 2016-03-31Shielded radio-frequency module having reduced area
#68 | 2016-03-10Devices and methods related to metallization of ceramic substrates for shielding applications
#69 | 2016-03-03Intramodule radio frequency isolation
#70 | 2016-02-11Radio frequency module including segmented conductive top layer
#71 | 2016-02-11Via density in radio frequency shielding applications
#72 | 2016-02-04DEVICES AND METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE HAVING SUBSTRATE CAVITY
#73 | 2016-02-04DEVICES AND METHODS RELATED TO SUPPORT FOR PACKAGING SUBSTRATE PANEL HAVING CAVITIES
#74 | 2016-01-14METHODS RELATED TO PACKAGED MODULES HAVING TUNED SHIELDING
#75 | 2015-11-12Power amplifier modules with bifet and harmonic termination and related systems, devices, and methods
#76 | 2015-11-12Power amplifier modules including bipolar transistor with grading and related systems, devices, and methods
#77 | 2015-11-12Power amplifier modules including wire bond pad and related systems, devices, and methods
#78 | 2015-05-07Via placement in radio frequency shielding applications
#79 | 2015-05-07Devices and methods related to packaging of radio-frequency devices on ceramic substrates
#80 | 2014-10-16Apparatus and methods related to ground paths implemented with surface mount devices
#81 | 2014-10-16Apparatus and methods related to conformal coating implemented with surface mount devices
#82 | 2014-06-26Segmented conductive top layer for radio frequency isolation
#83 | 2014-06-26Systems and methods for providing intramodule radio frequency isolation
#84 | 2014-04-03Systems and methods related to near-field electromagnetic scanners
#85 | 2014-01-16Racetrack design in radio frequency shielding applications
#86 | 2014-01-02Power amplifier modules including related systems, devices, and methods
#87 | 2013-12-19Semiconductor package having a metal paint layer
#88 | 2013-12-05Via density and placement in radio frequency shielding applications
#89 | 2013-01-24Radio-frequency modules having tuned shielding-wirebonds
#90 | 2009-10-293-D stacking of active devices over passive devices
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