Hien Boon Tan

City:

Country:

United States

Published Applications:

Last publication date:

2005-12-15

Top Assignees for applications by Hien Boon Tan

The entities that hold a legal rights for patent applications filed by inventor Tan Hien Boon:

Hien Boon Tan from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

High density chip scale leadframe package and method of manufacturing the package

InventorID:

4957797 ⎘