Anthony Yi Sheng Sun

City:

Country:

United States

Published Applications:

Last publication date:

2005-12-15

Top Assignees for applications by Anthony Yi Sheng Sun

The entities that hold a legal rights for patent applications filed by inventor Sun Anthony Yi Sheng:

Anthony Yi Sheng Sun from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

High density chip scale leadframe package and method of manufacturing the package

InventorID:

4957798 ⎘