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Inventor profile of:

Hiroshi Sagane

City:

Osaka

Country:

Japan

Published Applications:

1

Last publication date:

2005-12-22

Top Assignees for applications by Hiroshi Sagane

The entities that hold a legal rights for patent applications filed by inventor Sagane Hiroshi:

DAICEL POLYMER LTD. 1 Tokyo, Japan

Recent patent applications by Sagane Hiroshi

Hiroshi Sagane from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2005-12-22

US20050279738A1

Chemistry; metallurgy

Resin molded body joining method

InventorID:

4960544 ⎘