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Inventor profile of:

Johann Enthammer

City:

Mining

Country:

Austria

Published Applications:

1

Last publication date:

2021-01-07

Recent patent applications by Enthammer Johann

Johann Enthammer from Mining, AT has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-01-07

US20210005571A1

Bonding Device

InventorID:

4970836 ⎘