Mountain View, California
United States
39
2015-07-30
The entities that hold a legal rights for patent applications filed by inventor Thie William:
William Thie from Mountain View, US has applied for patents for these inventions. The list has both pending applications and granted patents:
PROCESSES AND SYSTEMS FOR ENGINEERING A BARRIER SURFACE FOR COPPER DEPOSITION
#2 | 2015-02-05SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTROLESS COPPER PLATING
#3 | 2014-10-30PROCESSES AND SYSTEMS FOR ENGINEERING A COPPER SURFACE FOR SELECTIVE METAL DEPOSITION
#4 | 2013-12-05Post-deposition cleaning methods for substrates with cap layers
#5 | 2013-10-24Method and apparatus for wafer electroless plating
#6 | 2012-10-25Processes and Systems for Engineering a Barrier Surface for Copper Deposition
#7 | 2012-02-23Wafer electroless plating system and associated methods
#8 | 2011-12-15INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING A DAMASCENE STRUCTURE
#9 | 2011-04-07Method and apparatus for material deposition
#10 | 2011-01-20Simultaneous electroless plating of two substrates
#11 | 2010-09-23Apparatus for Applying a Plating Solution for Electroless Deposition
#12 | 2010-05-06Methods for removing a metal oxide from a substrate
#13 | 2010-01-14Methods and systems for barrier layer surface passivation
#14 | 2009-12-10Self assembled monolayer for improving adhesion between copper and barrier layer
#15 | 2009-06-25Post-deposition cleaning methods and formulations for substrates with cap layers
#16 | 2008-11-13Thermal methods for cleaning post-CMP wafers
#17 | 2008-10-16Wafer electroless plating system and associated methods
#18 | 2008-10-16Method and apparatus for wafer electroless plating
#19 | 2008-10-16Fluid handling system for wafer electroless plating and associated methods
#20 | 2008-07-10Method and apparatus for semiconductor wafer planarization
#21 | 2008-06-26Method for electroless depositing a material on a surface of a wafer
#22 | 2008-06-26Self-limiting plating method
#23 | 2008-06-19Methods and systems for barrier layer surface passivation
#24 | 2008-06-19Interconnect structure and method of manufacturing a damascene structure
#25 | 2008-04-10Electroless plating method and apparatus
#26 | 2008-03-06Controlled ambient system for interface engineering
#27 | 2008-03-06METHOD FOR GAP FILL IN CONTROLLED AMBIENT SYSTEM
#28 | 2007-12-20Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide
#29 | 2007-12-20Processes and systems for engineering a copper surface for selective metal deposition
#30 | 2007-12-20Processes and systems for engineering a barrier surface for copper deposition
#31 | 2007-11-20Plating solutions for electroless deposition of copper
#32 | 2007-11-15Apparatus for applying a plating solution for electroless deposition
#33 | 2007-03-29Apparatus for the removal of a metal oxide from a substrate and methods therefor
#34 | 2007-03-01SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTROLESS COPPER PLATING
#35 | 2006-05-09Method and apparatus for megasonic cleaning with reflected acoustic waves
#36 | 2006-02-07Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiency
#37 | 2006-01-05Megasonic cleaning efficiency using auto-tuning of a RF generator at constant maximum efficiency
#38 | 2005-06-16Method and apparatus for material deposition in semiconductor fabrication
#39 | 2005-06-16Method and apparatus for semiconductor wafer planarization
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