Daisuke IKEDA

City:

Okayama

Country:

Japan

Published Applications:

Last publication date:

2021-01-21

Top Assignees for applications by Daisuke IKEDA

The entities that hold a legal rights for patent applications filed by inventor IKEDA Daisuke:

NUVOTON TECHNOLOGY CORPORATION JAPAN 1 Kyoto, Japan

Recent patent applications by IKEDA Daisuke

Daisuke IKEDA from Okayama, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-01-21

US20210016395A1

Performing operations; transporting

Puncture forming method, sample separating method, semiconductor element manufacturing method, semiconductor laser element manufacturing method, and semiconductor laser element

InventorID:

4979075 ⎘