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Inventor profile of:

Hakjun ` Lee

City:

Hwaseong-si

Country:

Korea (South)

Published Applications:

1

Last publication date:

2021-02-25

Recent patent applications by Lee Hakjun `

Hakjun ` Lee from Hwaseong-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-02-25

US20210057263A1

Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatus

InventorID:

5012080 ⎘