Shanghai
China
5
2025-12-18
The entities that hold a legal rights for patent applications filed by inventor Ti Yang:
Yang Ti from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
CURABLE ADHESIVE COMPOSITION COMPRISING MALEIMIDE AND THIOL
#2 | 2024-07-18THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND USE THEREOF
#3 | 2023-06-08CONDUCTIVE EPOXY RESIN COMPOSITION FOR COPPER BONDING
#4 | 2022-10-06Silver sintering composition containing copper alloy for metal bonding
#5 | 2021-03-04CURABLE ADHESIVE COMPOSITION FOR DIE ATTACH
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