John C. MEYER

City:

Redmond, Washington

Country:

United States

Published Applications:

Last publication date:

2021-03-04

Top Assignees for applications by John C. MEYER

The entities that hold a legal rights for patent applications filed by inventor MEYER John C.:

John C. MEYER from Redmond, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Opening force control for foldable electronic devices

InventorID:

5017476 ⎘