Brian Schieck

City:

Santa Clara, California

Country:

United States

Published Applications:

Last publication date:

2021-05-20

Top Assignees for applications by Brian Schieck

The entities that hold a legal rights for patent applications filed by inventor Schieck Brian:

Brian Schieck from Santa Clara, US has applied for patents for these inventions. The list has both pending applications and granted patents:

IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures

IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures

InventorID:

5019456 ⎘