Hsinchu
Taiwan
38
2025-11-27
The entities that hold a legal rights for patent applications filed by inventor Chen Yu-Hao:
Yu-Hao Chen from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
DEVICE LEVEL THERMAL DISSIPATION
#2 | 2025-11-13METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
#3 | 2025-11-13METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING
#4 | 2025-10-02INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
#5 | 2025-08-14SEMICONDUCTOR PACKAGES
#6 | 2025-02-13INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
#7 | 2024-12-05PROBE SYSTEM FOR TESTING DEVICE UNDER TEST INTEGRATED IN SEMICONDUCTOR WAFER, AND PROBE CARD, PROBE HEAD AND GUIDE PLATE STRUCTURE THEREOF
#8 | 2024-11-28PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMICONDUCTOR WAFER, AND PROBE CARD, PROBE HEAD, AND GUIDING PLATE STRUCTURE THEREIN
#9 | 2024-11-28PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMICONDUCTOR WAFER, AND PROBE CARD, PROBE HEAD, AND GUIDING PLATE STRUCTURE THEREIN
#10 | 2024-11-07Heat Dissipation in Semiconductor Packages and Methods of Forming Same
#11 | 2024-10-31INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
#12 | 2024-10-17SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#13 | 2024-09-19Directionally tunable optical reflector
#14 | 2024-09-05METHODS OF SELECTING DEVICES IN CIRCUIT DESIGN
#15 | 2024-06-27INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
#16 | 2024-02-29Package structure
#17 | 2024-02-29METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE
#18 | 2024-02-08Methods for making semiconductor-based integrated circuits
#19 | 2024-01-18Info packages including thermal dissipation blocks
#20 | 2023-11-30METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
#21 | 2023-11-30METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING
#22 | 2023-09-07Semiconductor packages
#23 | 2023-08-17PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#24 | 2023-07-20Directionally tunable optical reflector
#25 | 2023-04-06Heat dissipation in semiconductor packages and methods of forming same
#26 | 2023-02-09Info packages including thermal dissipation blocks
#27 | 2023-02-02Memory device, package structure and fabricating method thereof
#28 | 2023-02-02DEVICE LEVEL THERMAL DISSIPATION
#29 | 2022-12-01Semiconductor device including optical through via and method of making
#30 | 2022-11-17Info packages including thermal dissipation blocks
#31 | 2022-10-27Semiconductor structure
#32 | 2022-10-27Integrated circuit device and method
#33 | 2022-09-22Directionally tunable optical reflector
#34 | 2022-08-04Semiconductor structure and method of manufacturing a semiconductor structure
#35 | 2022-06-23Methods for making semiconductor-based integrated circuits
#36 | 2022-05-05Semiconductor packages
#37 | 2022-01-27Heat dissipation in semiconductor packages and methods of forming same
#38 | 2021-03-04Semiconductor packages
5019478 ⎘