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Inventor profile of:

Minoru KAKITANI

City:

Tokyo

Country:

Japan

Published Applications:

10

Last publication date:

2024-01-25

Top Assignees for applications by Minoru KAKITANI

The entities that hold a legal rights for patent applications filed by inventor KAKITANI Minoru:

Showa Denko Materials Co., Ltd. 5 Tokyo, Japan
RESONAC CORPORATION 4 Tokyo, Japan
HITACHI CHEMICAL COMPANY, LTD. 2 Tokyo, Japan

Recent patent applications by KAKITANI Minoru

Minoru KAKITANI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-01-25

US20240032209A1

Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package

#2 | 2023-12-07

US20230392001A1

Chemistry; metallurgy

Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package

#3 | 2023-12-07

US20230391940A1

Chemistry; metallurgy

MALEIMIDE RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

#4 | 2021-06-24

US20210187923A1

Performing operations; transporting

Fluororesin substrate laminate

#5 | 2021-03-18

US20210079172A1

Chemistry; metallurgy

Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition

#6 | 2020-01-02

US20200002526A1

Chemistry; metallurgy

Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board

#7 | 2019-11-07

US20190338093A1

Chemistry; metallurgy

Resin varnish, prepreg, laminate, and printed wiring board

#8 | 2019-08-08

US20190241729A1

Chemistry; metallurgy

Resin composition, laminate sheet, and multilayer printed wiring board

#9 | 2019-08-08

US20190241717A1

Chemistry; metallurgy

Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radar

#10 | 2019-06-06

US20190169432A1

Chemistry; metallurgy

Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module

InventorID:

5029068 ⎘