Poughkeepsie, New York
United States
25
2018-06-14
The entities that hold a legal rights for patent applications filed by inventor Perfecto Eric D.:
Eric D. Perfecto from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:
FAN-OUT CIRCUIT PACKAGING WITH INTEGRATED LID
#2 | 2017-07-27Electrodeposition systems and methods that minimize anode and/or plating solution degradation
#3 | 2017-05-25Structure for establishing interconnects in packages using thin interposers
#4 | 2017-03-28Method for establishing interconnects in packages using thin interposers
#5 | 2016-11-10Silver alloying post-chip join
#6 | 2016-10-20Semiconductor device contact structure having stacked nickel, copper, and tin layers
#7 | 2016-04-28Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer
#8 | 2016-03-17Use of electrolytic plating to control solder wetting
#9 | 2016-02-25Multilayered contact structure having nickel, copper, and nickel-iron layers
#10 | 2015-11-26Electrodeposition systems and methods that minimize anode and/or plating solution degradation
#11 | 2015-11-19Organic coating to inhibit solder wetting on pillar sidewalls
#12 | 2015-10-29Contact and solder ball interconnect
#13 | 2015-08-20Universal solder joints for 3D packaging
#14 | 2014-11-20Under ball metallurgy (UBM) for improved electromigration
#15 | 2014-10-30Far back end of the line metallization method and structures
#16 | 2014-09-18Under ball metallurgy (UBM) for improved electromigration
#17 | 2014-01-23Solder volume compensation with C4 process
#18 | 2013-10-31Additives for grain fragmentation in Pb-free Sn-based solder
#19 | 2012-12-06Injection molded solder process for forming solder bumps on substrates
#20 | 2012-12-06Injection molded solder process for forming solder bumps on substrates
#21 | 2012-08-30Flip chip assembly method employing post-contact differential heating
#22 | 2011-03-17Robust FBEOL and UBM structure of C4 interconnects
#23 | 2009-10-29Optimization of metallurgical properties of a solder joint
#24 | 2006-12-28Composite solder transfer moldplate structure and method of making same
#25 | 2006-11-16Materials and method to seal vias in silicon substrates
503301 ⎘