STS Semiconductor & Telecommunications Co., Ltd.

City:

Country:

United States

Published Applications:

Last publication date:

2014-04-10

Top Assignees for applications by STS Semiconductor & Telecommunications Co., Ltd.

The entities that hold a legal rights for patent applications filed by inventor Ltd. STS Semiconductor & Telecommunications Co.,:

STS Semiconductor & Telecommunications Co., Ltd. 3 Chungcheongnam-do, Korea (South)
STS Semiconductor & Telecommunications Co., Ltd. 3 Chungcheongnam-Do, Korea (South)
STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD. 1 Cheonan-si, Korea (South)

Recent patent applications by Ltd. STS Semiconductor & Telecommunications Co.,

STS Semiconductor & Telecommunications Co., Ltd. from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-04-10

US20140097530A1

Electricity

INTEGRATED CIRCUIT PACKAGE

#2 | 2013-12-05

US20130320518A1

Electricity

Wafer-level package and method of manufacturing the same

#3 | 2013-11-28

US20130316496A1

Electricity

Method of manufacturing semiconductor package having no chip pad

#4 | 2013-10-31

US20130285222A1

Electricity

Semiconductor package and method of manufacturing the same

InventorID:

504251 ⎘