Tokyo
Japan
20
2026-05-21
The entities that hold a legal rights for patent applications filed by inventor MURATA Daisuke:
Daisuke MURATA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
DECORATIVE SHEET
#2 | 2026-03-19METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#3 | 2025-10-30DECORATIVE SHEET
#4 | 2023-10-12METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#5 | 2022-03-17DECORATIVE SHEET
#6 | 2021-05-13PROTECTIVE FILM AND SHEET
#7 | 2021-04-01Semiconductor device comprising sealing members with different elastic modulus and method for manufacturing semiconductor device
#8 | 2021-04-01Protective film and sheet
#9 | 2020-07-23Semiconductor device having a conductive film on an inner wall of a through hole
#10 | 2020-05-21Semiconductor device, electric power conversion apparatus and method for manufacturing semiconductor device
#11 | 2020-03-12Semiconductor device and electric power conversion apparatus
#12 | 2019-10-03Semiconductor apparatus, method for manufacturing the same and electric power conversion device
#13 | 2019-05-30Semiconductor device and power conversion device
#14 | 2018-12-13Semiconductor device
#15 | 2018-10-11Semiconductor device
#16 | 2018-07-17Power module
#17 | 2017-12-28Semiconductor device
#18 | 2017-04-13SEMICONDUCTOR DEVICE
#19 | 2015-04-02Semiconductor device and method for manufacturing the same
#20 | 2013-10-31Semiconductor device having improved thermal properties
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