Inventor profile of:

Matthew E. LAST

City:

Santa Clara, California

Country:

United States

Published Applications:

25

Last publication date:

2024-11-07

Top Assignees for applications by Matthew E. LAST

The entities that hold a legal rights for patent applications filed by inventor LAST Matthew E.:

Recent patent applications by LAST Matthew E.

Matthew E. LAST from Santa Clara, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-11-07
US20240370548A1
Physics

AUTOMATED DEVICE ACCESS

#2 | 2023-12-21
US20230409691A1
Physics

Automated device access

#3 | 2021-12-09
US20210382977A1
Physics

Automated device access

#4 | 2019-11-05
US15263971
Performing operations; transporting

Lighting systems of vehicle seats

#5 | 2019-08-01
US20190236257A1
Physics

Identity Proxy for Access Control Systems

#6 | 2018-11-08
US20180324586A1
Electricity

Automated device access

#7 | 2017-12-14
US20170357099A1
Physics

Overlay Display

#8 | 2016-03-15
US14160382
Physics

3D depth point cloud from timing flight of 2D scanned light beam pulses

#9 | 2016-03-10
US20160069751A1
Physics

Electronic devices with temperature sensors

#10 | 2015-10-15
US20150296622A1
Electricity

Flexible Printed Circuit With Semiconductor Strain Gauge

#11 | 2015-10-15
US20150296607A1
Electricity

Electronic Device With Flexible Printed Circuit Strain Gauge Sensor

#12 | 2015-08-13
US20150230339A1
Electricity

Methods for forming a sensor array package

#13 | 2015-01-15
US20150020173A1
Electricity

Automated device access

#14 | 2014-08-14
US20140227833A1
Electricity

Methods for forming a sensor array package

#15 | 2014-07-17
US20140197317A1
Physics

Infrared sensors for electronic devices

#16 | 2014-04-24
US20140112510A1
Electricity

Electronic devices with environmental sensors

#17 | 2014-04-24
US20140112371A1
Physics

Electronic devices with temperature sensors

#18 | 2014-04-03
US20140091439A1
Electricity

Silicon shaping

#19 | 2014-03-27
US20140084454A1
Electricity

Direct multiple substrate die assembly

#20 | 2014-03-27
US20140084425A1
Electricity

Perimeter trench sensor array package

#21 | 2014-03-13
US20140072148A1
Electricity

Bone-conduction pickup transducer for microphonic applications

#22 | 2014-03-06
US20140068751A1
Physics

Automated device access

#23 | 2014-02-06
US20140038357A1
Electricity

SINGULATED IC STIFFENER AND DE-BOND PROCESS

#24 | 2013-10-31
US20130285263A1
Electricity

Sensor array package

#25 | 2013-10-31
US20130285240A1
Electricity

Sensor array package

InventorID:

504268 ⎘