Risa Miyazawa

City:

Kanagawa

Country:

Japan

Published Applications:

Last publication date:

2021-08-05

Top Assignees for applications by Risa Miyazawa

The entities that hold a legal rights for patent applications filed by inventor Miyazawa Risa:

Risa Miyazawa from Kanagawa, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Resist structure for forming bumps

Prevention of bridging between solder joints

Interconnection with side connection to substrate

InventorID:

5044299 ⎘