Bradley J. Mitchell

City:

Everett, Washington

Country:

United States

Published Applications:

Last publication date:

2021-04-29

Top Assignees for applications by Bradley J. Mitchell

The entities that hold a legal rights for patent applications filed by inventor Mitchell Bradley J.:

The Boeing Company 2 Chicago, IL United States
The Boeing Company 1 Arlington, VA United States

Recent patent applications by Mitchell Bradley J.

Bradley J. Mitchell from Everett, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-04-29

US20210126418A1

Electricity

Form board preparation for wire bundling

#2 | 2021-04-29

US20210125749A1

Electricity

Form board preparation for wire bundling

InventorID:

5065894 ⎘