Austin, Texas
United States
19
2026-01-01
The entities that hold a legal rights for patent applications filed by inventor McDermott Mark:
Mark McDermott from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT
#2 | 2026-01-01HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING MOIRÉ BASED METROLOGY AND VACUUM BASED PICK-AND-PLACE
#3 | 2026-01-01NANOFABRICATION AND DESIGN TECHNIQUES FOR 3D ICS AND CONFIGURABLE ASICS
#4 | 2026-01-01NANOFABRICATION AND DESIGN TECHNIQUES FOR 3D ICS AND CONFIGURABLE ASICS
#5 | 2025-12-18NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT
#6 | 2025-12-18NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT
#7 | 2025-12-18HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING MOIRÉ BASED METROLOGY AND VACUUM BASED PICK-AND-PLACE
#8 | 2025-12-18HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING MOIRÉ BASED METROLOGY AND VACUUM BASED PICK-AND-PLACE
#9 | 2025-09-11HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING MOIRÉ BASED METROLOGY AND VACUUM BASED PICK-AND-PLACE
#10 | 2024-12-26NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT
#11 | 2024-10-03Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place
#12 | 2023-12-28NANOFABRICATION AND DESIGN TECHNIQUES FOR 3D ICS AND CONFIGURABLE ASICS
#13 | 2023-04-20NANOFABRICATION AND DESIGN TECHNIQUES FOR 3D ICS AND CONFIGURABLE ASICS
#14 | 2023-04-20NANOFABRICATION AND DESIGN TECHNIQUES FOR 3D ICS AND CONFIGURABLE ASICS
#15 | 2023-04-13Nanoscale-aligned three-dimensional stacked integrated circuit
#16 | 2023-02-09Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place
#17 | 2021-11-25Nanoscale-aligned three-dimensional stacked integrated circuit
#18 | 2021-11-11Nanofabrication and design techniques for 3D ICs and configurable ASICs
#19 | 2021-05-06Heterogeneous integration of components onto compact devices using moire based metrology and vacuum based pick-and-place
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