Tokyo
Japan
13
2022-11-24
The entities that hold a legal rights for patent applications filed by inventor SUGAMA Chie:
Chie SUGAMA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY
#2 | 2022-01-27Method for producing bonded object and semiconductor device and copper bonding paste
#3 | 2021-11-11Member connection method
#4 | 2021-05-13Copper paste for pressureless bonding, bonded body and semiconductor device
#5 | 2020-10-29Method for producing joined body, and joining material
#6 | 2020-09-17Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module
#7 | 2020-06-04Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
#8 | 2020-04-30Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
#9 | 2020-04-09Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
#10 | 2020-03-05Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
#11 | 2019-11-21Copper paste for pressureless bonding, bonded body and semiconductor device
#12 | 2018-11-29Assembly and semiconductor device
#13 | 2018-09-06Copper paste for joining, method for producing joined body, and method for producing semiconductor device
5080022 ⎘