Masashi OKANIWA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2022-12-08

Top Assignees for applications by Masashi OKANIWA

The entities that hold a legal rights for patent applications filed by inventor OKANIWA Masashi:

Mitsubishi Gas Chemical Company, Inc. 7 Tokyo, Japan

Recent patent applications by OKANIWA Masashi

Masashi OKANIWA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-12-08

US20220389130A1

Chemistry; metallurgy

FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE

#2 | 2022-12-01

US20220380508A1

Chemistry; metallurgy

RESIN COMPOSITION, RESIN SHEET, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE

#3 | 2022-10-27

US20220344227A1

Electricity

FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING A SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE

#4 | 2022-10-20

US20220332868A1

Chemistry; metallurgy

Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device

#5 | 2021-09-09

US20210277221A1

Chemistry; metallurgy

Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device

#6 | 2021-05-20

US20210147680A1

Chemistry; metallurgy

RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE

#7 | 2021-05-20

US20210147629A1

Chemistry; metallurgy

Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device

InventorID:

5083371 ⎘