Tokyo
Japan
11
2025-04-03
The entities that hold a legal rights for patent applications filed by inventor TAKEDA Keisuke:
Keisuke TAKEDA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
THIN-FILM FORMING RAW MATERIAL USED IN ATOMIC LAYER DEPOSITION METHOD AND METHOD OF PRODUCING THIN-FILM
#2 | 2024-12-26THIN-FILM FORMING RAW MATERIAL, METHOD OF PRODUCING THIN-FILM, THIN-FILM, AND MOLYBDENUM COMPOUND
#3 | 2024-10-10COBALT COMPOUND, THIN-FILM FORMING RAW MATERIAL, THIN-FILM, AND METHOD OF PRODUCING THIN-FILM
#4 | 2024-05-23THIN-FILM FORMING RAW MATERIAL, WHICH IS USED IN ATOMIC LAYER DEPOSITION METHOD, THIN-FILM, METHOD OF PRODUCING THIN-FILM, AND ZINC COMPOUND
#5 | 2024-02-22INDIUM COMPOUND, THIN-FILM FORMING RAW MATERIAL, THIN FILM, AND METHOD OF PRODUCING SAME
#6 | 2023-05-18THIN-FILM FORMING RAW MATERIAL USED IN ATOMIC LAYER DEPOSITION METHOD AND METHOD OF PRODUCING THIN-FILM
#7 | 2023-05-18Amidinate compound, dimer compound thereof, thin-film forming raw material, and method of producing thin film
#8 | 2023-05-11ZINC COMPOUND, THIN-FILM FORMING RAW MATERIAL, THIN-FILM, AND METHOD OF PRODUCING THIN-FILM
#9 | 2022-12-08Compound, thin-film forming raw material that contains said compound, and method of manufacturing thin film
#10 | 2022-11-24Ruthenium compound, thin-film forming raw material, and method of producing thin film
#11 | 2021-05-27RAW MATERIAL FOR FORMING THIN FILM BY ATOMIC LAYER DEPOSITION METHOD AND METHOD FOR PRODUCING THIN FILM
5089519 ⎘