Daniel Bischoff

City:

Bensheim

Country:

Germany

Published Applications:

Last publication date:

2024-10-31

Top Assignees for applications by Daniel Bischoff

The entities that hold a legal rights for patent applications filed by inventor Bischoff Daniel:

Daniel Bischoff from Bensheim, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Electrically Insulating Test Cap for a High-Voltage Contact, a Housing with an Electrically Insulating Test Cap and a High-Voltage Box

Electrical connector with minimal transfer of torsional load

Crimp connection and crimp method for a crimp assembly with at least one retention shoulder

InventorID:

5092797 ⎘