Taichung
Taiwan
19
2026-05-21
The entities that hold a legal rights for patent applications filed by inventor Lee Jungbae:
Jungbae Lee from Taichung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
CONDUCTIVE ORGANIC MODULE FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS
#2 | 2025-01-23METHODS FOR SEPARATING SEMICONDUCTOR DEVICES USING SINGULATION GROOVES, AND DEVICES RESULTING FROM SUCH METHODS
#3 | 2024-08-22SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METHODS FOR MANUFACTURING THE SAME
#4 | 2024-05-02LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL
#5 | 2024-01-11SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS AND METHODS FOR FORMING THE SAME
#6 | 2023-03-02CONDUCTIVE ORGANIC MODULE FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS
#7 | 2023-02-09STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES
#8 | 2022-10-13Semiconductor device assembly with graded modulus underfill and associated methods and systems
#9 | 2022-09-08Stacked semiconductor dies for semiconductor device assemblies
#10 | 2022-08-25Stacked semiconductor dies for semiconductor device assemblies
#11 | 2022-08-11Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same
#12 | 2022-04-07Semiconductor die with capillary flow structures for direct chip attachment
#13 | 2022-03-17Semiconductor device assembly with embossed solder mask having non-planar features and associated methods and systems
#14 | 2022-03-03Semiconductor device assembly with graded modulus underfill and associated methods and systems
#15 | 2022-02-24Stacked semiconductor dies for semiconductor device assemblies
#16 | 2021-12-16Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same
#17 | 2021-12-02Solderless interconnect for semiconductor device assembly
#18 | 2021-06-24Semiconductor die with capillary flow structures for direct chip attachment
#19 | 2021-06-17Solderless interconnect for semiconductor device assembly
5111632 ⎘