Benjamin R. Hoffman

City:

Columbus, Ohio

Country:

United States

Published Applications:

Last publication date:

2021-07-15

Top Assignees for applications by Benjamin R. Hoffman

The entities that hold a legal rights for patent applications filed by inventor Hoffman Benjamin R.:

OWENS CORNING INTELLECTUAL CAPITAL, LLC 1 Toledo, OH United States

Recent patent applications by Hoffman Benjamin R.

Benjamin R. Hoffman from Columbus, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-07-15

US20210214944A1

Fixed constructions

Roofing materials including a parting agent layer

InventorID:

5135664 ⎘