Aaron HAHN

City:

Berlin

Country:

Germany

Published Applications:

Last publication date:

2021-08-12

Top Assignees for applications by Aaron HAHN

The entities that hold a legal rights for patent applications filed by inventor HAHN Aaron:

Aaron HAHN from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer

InventorID:

5163184 ⎘