Brian Paul Hetzel

City:

Boardman, Ohio

Country:

United States

Published Applications:

Last publication date:

2021-08-19

Recent patent applications by Hetzel Brian Paul

Brian Paul Hetzel from Boardman, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Ceramic-metallic composites with improved properties and their methods of manufacture

Ceramic-metallic composites devoid of porosity and their methods of manufacture

InventorID:

5165307 ⎘