Wei Liu

City:

Espoo

Country:

Finland

Published Applications:

Last publication date:

2025-05-08

Top Assignees for applications by Wei Liu

The entities that hold a legal rights for patent applications filed by inventor Liu Wei:

IQM Finland Oy 5 Espoo, Finland

Recent patent applications by Liu Wei

Wei Liu from Espoo, FI has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-05-08

US20250148336A1

Physics

QUBIT THERMAL STATE INITIALISATION

#2 | 2024-03-28

US20240107899A1

Electricity

SUPERCONDUCTING VACUUM-BRIDGED JOSEPHSON JUNCTIONS

#3 | 2022-11-10

US20220359808A1

Electricity

Electroplating for vertical interconnections

#4 | 2022-11-10

US20220359415A1

Electricity

SUPERCONDUCTING THROUGH SUBSTRATE VIAS

#5 | 2022-07-28

US20220238781A1

Electricity

Superconducting device

#6 | 2022-06-09

US20220181538A1

Electricity

Method for manufacturing Josephson junctions

#7 | 2022-05-26

US20220164690A1

Physics

Three-dimensional superconducting qubit and a method for manufacturing the same

#8 | 2022-01-13

US20220012617A1

Physics

QUANTUM COMPUTING CIRCUIT COMPRISING A PLURALITY OF CHIPS AND METHOD FOR MANUFACTURING THE SAME

#9 | 2021-08-26

US20210265261A1

Electricity

Airbridge for making connections on superconducting chip, and method for producing superconducting chips with airbridges

InventorID:

5174642 ⎘