Murphy, Texas
United States
5
2026-04-02
The entities that hold a legal rights for patent applications filed by inventor Lin Hung-Yun:
Hung-Yun Lin from Murphy, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DIE CAP AND MANUFACTURING METHOD
#2 | 2025-03-20PACKAGES WITH LOW-PROFILE POLYIMIDE LAYERS
#3 | 2024-10-31EFFICIENT REDISTRIBUTION LAYER TOPOLOGY FOR HIGH-POWER SEMICONDUCTOR PACKAGES
#4 | 2023-03-30Wire bond damage detector including a detection bond pad over a first and a second connected structures
#5 | 2021-09-16Wire bond damage detector including a detection bond pad over a first and a second connected structures
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