Hsinchu
Taiwan
21
2026-06-18
The entities that hold a legal rights for patent applications filed by inventor CHENG Ming-Da:
Ming-Da CHENG from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
FLUX CLEANER COMPOSITION AND METHODS OF FABRICATING A SEMICONDUCTOR STRUCTURE
#2 | 2025-11-27NON-DMSO STRIPPER FOR ADVANCE PACKAGE METAL PLATING PROCESS
#3 | 2025-11-20METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME
#4 | 2025-10-16NON-DMSO STRIPPER FOR ADVANCE PACKAGE METAL PLATING PROCESS
#5 | 2025-10-09SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND METHODS OF FORMING THE SAME
#6 | 2025-09-25DIE AND CARRIER REMOVAL TOOL AND METHOD OF UTILIZING THE SAME
#7 | 2025-04-10PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME
#8 | 2025-04-10PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHODS OF FORMING THE SAME
#9 | 2024-11-21METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME
#10 | 2024-10-31Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale Package
#11 | 2024-10-03INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS OF FORMING THE SAME
#12 | 2023-10-05NON-DMSO STRIPPER FOR ADVANCE PACKAGE METAL PLATING PROCESS
#13 | 2021-09-16SEMICONDUCTOR PACKAGE AND METHOD OF MAKING
#14 | 2018-03-29Method of manufacturing wafer level chip scale package
#15 | 2016-09-15Semiconductor packaging structure and manufacturing method thereof
#16 | 2016-07-28Semiconductor packaging and manufacturing method thereof
#17 | 2016-07-21Manufacturing method of interconnect structure
#18 | 2015-08-27Wafer level chip scale package and method of manufacturing the same
#19 | 2015-08-20Method for manufacturing semiconductor structure
#20 | 2015-03-05Semiconductor structure and manufacturing method thereof
#21 | 2014-12-18Singulation apparatus and method
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