Rochester, Minnesota
United States
52
2024-03-21
The entities that hold a legal rights for patent applications filed by inventor Hoffmeyer Mark K.:
Mark K. Hoffmeyer from Rochester, US has applied for patents for these inventions. The list has both pending applications and granted patents:
LOW-CURRENT VOLTAGE SOURCE WATCHDOG
#2 | 2024-02-15APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK
#3 | 2024-01-04Standoff And Support Structures for Reliable Land Grid Array and Hybrid Land Grid Array Interconnects
#4 | 2023-11-16Liquid metal infiltration rework of electronic assembly
#5 | 2023-01-19Reliability enhancement of press fit connectors
#6 | 2022-10-20Thermal interface material structures for directing heat in a three-dimensional space
#7 | 2022-07-21Liquid metal infiltration rework of electronic assembly
#8 | 2022-01-27Land grid array electrical contact coating
#9 | 2022-01-18Connecting a component to a substrate by adhesion to an oxidized solder surface
#10 | 2021-10-14Thermal interface material structures for directing heat in a three-dimensional space
#11 | 2021-10-14Pierced thermal interface constructions
#12 | 2021-04-22Liquid metal infiltration rework of electronic assembly
#13 | 2021-04-22Liquid metal infiltration rework of electronic assembly
#14 | 2021-04-15Integrated circuit module with a structurally balanced package using a bottom side interposer
#15 | 2021-04-15Fixture facilitating heat sink fabrication
#16 | 2021-03-25Thermal interface materials with radiative coupling heat transfer
#17 | 2021-03-18Reliability enhancement of press fit connectors
#18 | 2020-12-31Computer system with modified module socket
#19 | 2020-12-31Multi layer thermal interface material
#20 | 2020-12-24Applying a solderable surface to conductive ink
#21 | 2020-08-25Efficient placement of grid array components
#22 | 2020-07-09Thermal interface material structures
#23 | 2020-06-04Integrated circuit module with a structurally balanced package using a bottom side interposer
#24 | 2019-10-10Tamper-respondent sensors with liquid crystal polymer layers
#25 | 2019-08-29ADHESIVE-BONDED THERMAL INTERFACE STRUCTURES
#26 | 2019-08-29Adhesive-bonded thermal interface structures
#27 | 2019-08-22Fixture facilitating heat sink fabrication
#28 | 2019-04-18Thermal interface material structures
#29 | 2018-12-27Adhesive-bonded thermal interface structures
#30 | 2018-12-27Adhesive-bonded thermal interface structures for integrated circuit cooling
#31 | 2018-12-27Adhesive-bonded thermal interface structures
#32 | 2018-11-15Testing printed circuit board assembly
#33 | 2018-08-14Testing printed circuit board assembly
#34 | 2018-08-09Implementing reworkable strain relief packaging structure for electronic component interconnects
#35 | 2018-06-14Implementing reworkable strain relief packaging structure for electronic component interconnects
#36 | 2018-06-07Integrated circuit device assembly
#37 | 2017-12-28Thermal interface material structures
#38 | 2017-07-06Integrated circuit device assembly
#39 | 2017-03-30Twisted eye-of-needle compliant pin
#40 | 2017-03-30Eye-of-needle compliant pin
#41 | 2016-10-18Twisted eye-of-needle compliant pin
#42 | 2016-10-18Eye-of-needle compliant pin
#43 | 2015-07-09Area array device connection structures with complimentary warp characteristics
#44 | 2015-02-12Method of making a solder tail extender connector
#45 | 2014-09-18Area array device connection structures with complimentary warp characteristics
#46 | 2014-05-15Electronic component assembly
#47 | 2013-11-07Implementing hybrid molded solder-embedded pin contacts and connectors
#48 | 2011-12-29Meeting Calendar Optimization
#49 | 2011-11-24Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing
#50 | 2011-01-13Implementing enhanced connector guide block structures for robust SMT assembly
#51 | 2009-08-20Heat sink
#52 | 2008-12-25BACKPLANE CONNECTOR WITH HIGH DENSITY BROADSIDE DIFFERENTIAL SIGNALING CONDUCTORS
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