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Inventor profile of:

Hirofumi Ikawa

City:

Aichi

Country:

Japan

Published Applications:

3

Last publication date:

2024-01-18

Recent patent applications by Ikawa Hirofumi

Hirofumi Ikawa from Aichi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-01-18

US20240018390A1

Chemistry; metallurgy

POLISHING COMPOSITION

#2 | 2022-03-24

US20220089907A1

Chemistry; metallurgy

POLISHING COMPOSITION

#3 | 2021-09-23

US20210292601A1

Chemistry; metallurgy

Polishing method and method for manufacturing semiconductor substrate

InventorID:

5195338 ⎘