Ryan Lewis

City:

Boulder, Colorado

Country:

United States

Published Applications:

Last publication date:

2026-02-05

Top Assignees for applications by Ryan Lewis

The entities that hold a legal rights for patent applications filed by inventor Lewis Ryan:

Ryan Lewis from Boulder, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Enhanced Wicks for Thermal Ground Planes

Tube-In-Tube Heat Pipe

Deformed Mesh Thermal Ground Plane

Deformed Mesh Thermal Ground Plane

Three-Dimensional Meshes and Casings for Thermal Ground Planes

Deformed Mesh Thermal Ground Plane

Deformed Mesh Thermal Ground Plane

InventorID:

5196125 ⎘