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Inventor profile of:

Harry CHOU

City:

Austin, Texas

Country:

United States

Published Applications:

7

Last publication date:

2026-04-02

Top Assignees for applications by Harry CHOU

The entities that hold a legal rights for patent applications filed by inventor CHOU Harry:

  • GRAPHAUDIO INC. 4 Beverly Hills, CA United States

Recent patent applications by CHOU Harry

Harry CHOU from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-04-02
US20260096395A1
Electricity

CARRIER FOR DEBONDING OF BONDED STACK WITH PASSIVATION LAYER

#2 | 2025-10-16
US20250323207A1
Electricity

METHOD FOR BONDING ELECTRONICS STRUCTURES DURING INTEGRATED ELECTRONICS MANUFACTURING

#3 | 2025-09-25
US20250299995A1
Electricity

Roughened Carrier for Debonding of Bonded Stack

#4 | 2023-08-31
US20230276177A1
Electricity

TRANSPARENT ELECTROSTATIC TRANSDUCERS

#5 | 2022-09-08
US20220286786A1
Electricity

HIGH VOLUME MANUFACTURING OF MICRO ELECTROSTATIC TRANSDUCERS

#6 | 2021-10-28
US20210337316A1
Electricity

Transparent electrostatic transducers

#7 | 2021-09-23
US20210297788A1
Electricity

High volume manufacturing of micro electrostatic transducers

InventorID:

5199116 ⎘

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