Hsinchu
Taiwan
41
2026-04-30
The entities that hold a legal rights for patent applications filed by inventor Chen Chia-Wei:
Chia-Wei Chen from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
#2 | 2025-11-27SEMICONDUCTOR GATE AND CONTACT FORMATION
#3 | 2025-11-27METAL CAPS FOR GATE STRUCTURES
#4 | 2025-11-27SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE
#5 | 2025-11-20SEMICONDUCTOR DEVICE STRUCTURE
#6 | 2025-11-13POST GATE DIELECTRIC PROCESSING FOR SEMICONDUCTOR DEVICE FABRICATION
#7 | 2025-10-02FORMING LOW-RESISTANCE CAPPING LAYER OVER METAL GATE ELECTRODE
#8 | 2025-08-28METAL GATE FOR GATE-ALL-AROUND DEVICES AND METHODS FOR FORMING THE SAME
#9 | 2025-06-05Semiconductor Device and Method of Manufacture
#10 | 2025-06-05SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
#11 | 2024-12-19FEEDTHROUGH VIA BETWEEN ACTIVE REGIONS
#12 | 2024-12-12INTEGRATED CIRCUIT DEVICE WITH IMPROVED RELIABILITY
#13 | 2024-11-21SEMICONDUCTOR GATE AND CONTACT FORMATION
#14 | 2024-11-14MULTI-LAYER HIGH-K GATE DIELECTRIC STRUCTURE
#15 | 2024-11-14Forming Low-Resistance Capping Layer Over Metal Gate Electrode
#16 | 2024-09-19Nano-sheet-based complementary metal-oxide-semiconductor devices with asymmetric inner spacers
#17 | 2023-12-21POST GATE DIELECTRIC PROCESSING FOR SEMICONDUCTOR DEVICE FABRICATION
#18 | 2023-11-30Multi-layer high-k gate dielectric structure
#19 | 2023-11-30Semiconductor device and method of manufacture
#20 | 2023-10-26METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
#21 | 2023-10-26SEMICONDUCTOR GATE AND CONTACT FORMATION
#22 | 2023-09-14SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
#23 | 2023-08-24STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH METAL GATE
#24 | 2023-07-06Transistors with multiple threshold voltages
#25 | 2023-07-06Metal gate cap
#26 | 2023-03-02Integrated circuit device with improved reliability
#27 | 2023-01-19Metal Capping Layer for Reducing Gate Resistance in Semiconductor Devices
#28 | 2023-01-12Metal gate for gate-all-around devices and methods for forming the same
#29 | 2023-01-12Forming Low-Resistance Capping Layer Over Metal Gate Electrode
#30 | 2023-01-12METAL CAPS FOR GATE STRUCTURES
#31 | 2022-12-01Multi-layer high-k gate dielectric structure
#32 | 2022-11-17Nano-sheet-based complementary metal-oxide-semiconductor devices with asymmetric inner spacers
#33 | 2022-11-10Semiconductor device and method of manufacture
#34 | 2022-10-27Transistors with multiple threshold voltages
#35 | 2022-10-06Semiconductor device structure and methods of forming the same
#36 | 2022-09-08Forming low-resistance capping layer over metal gate electrode
#37 | 2022-09-01Metal gate cap
#38 | 2022-03-31Post gate dielectric processing for semiconductor device fabrication
#39 | 2021-12-16Semiconductor device and method of manufacture
#40 | 2021-09-30Multi-layer high-k gate dielectric structure
#41 | 2016-09-29Patterning process of a semiconductor structure with a wet strippable middle layer
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