Taichung
Taiwan
10
2025-04-17
The entities that hold a legal rights for patent applications filed by inventor Wang Chieh-Ping:
Chieh-Ping Wang from Taichung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
CUT METAL GATE REFILL WITH VOID
#2 | 2025-01-02MULTI-LAYERED INSULATING FILM STACK
#3 | 2024-11-07GATE STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING SAME
#4 | 2023-11-30Multi-layered insulating film stack
#5 | 2023-11-16SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
#6 | 2023-01-12Gate structures in transistor devices and methods of forming same
#7 | 2022-11-10Cut metal gate refill with void
#8 | 2022-09-01Multi-layered insulating film stack
#9 | 2021-12-30Multi-layered insulating film stack
#10 | 2021-10-07Cut metal gate refill with void
5211264 ⎘