Jun Kit WANG

City:

Singapore

Country:

Singapore

Published Applications:

Last publication date:

2023-05-25

Top Assignees for applications by Jun Kit WANG

The entities that hold a legal rights for patent applications filed by inventor WANG Jun Kit:

Jun Kit WANG from Singapore, SG has applied for patents for these inventions. The list has both pending applications and granted patents:

COMPOSITE SCAFFOLD MATERIAL

Hydrogel-forming peptides, and methods of use thereof

BULLFROG SKIN-DERIVED COLLAGEN, MATERIALS COMPRISING THEREOF, AND APPLICATIONS IN WOUND HEALING

InventorID:

5219795 ⎘