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Inventor profile of:

KEISUKE MORI

City:

Osaka

Country:

Japan

Published Applications:

2

Last publication date:

2021-12-09

Recent patent applications by MORI KEISUKE

KEISUKE MORI from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-12-09

US20210383985A1

RELAY MODULE

#2 | 2021-10-21

US20210327670A1

ELECTRONIC COMPONENT MODULE

InventorID:

5222828 ⎘