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Inventor profile of:

Dennis Trieu

City:

Calgary

Country:

Canada

Published Applications:

Last publication date:

2025-05-01

Top Assignees for applications by Dennis Trieu

The entities that hold a legal rights for patent applications filed by inventor Trieu Dennis:

Microsoft Technology Licensing, LLC 10 Redmond, WA United States
CoolIT Systems, Inc. 1 Alberta, Canada
MICROSOFT TEHCNOLOGY LICENSING, LLC 1 Redmond, WA United States
COOLIT SYSTEMS, INC. 1 Calgary, Canada

Recent patent applications by Trieu Dennis

Dennis Trieu from Calgary, CA has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-05-01

US20250142789A1

Electricity

LIQUID PUMPING UNITS, AND RELATED SYSTEMS AND METHODS

#2 | 2025-04-17

US20250123661A1

Physics

3-D STRUCTURED TWO-PHASE MICROFLUIDIC COOLING WITH NANO STRUCTURED BOILING ENHANCEMENT COATING

#3 | 2025-03-27

US20250107046A1

Electricity

SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES

#4 | 2025-03-13

US20250089208A1

Electricity

SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES

#5 | 2024-12-26

US20240431075A1

Electricity

3-D STRUCTURED TWO-PHASE COOLING BOILERS WITH NANO STRUCTURED BOILING ENHANCEMENT COATING

#6 | 2024-09-26

US20240322507A1

Electricity

Protected Busbars

#7 | 2024-06-27

US20240215203A1

Electricity

THERMAL TRANSFER STRUCTURES FOR IMMERSION COOLING

#8 | 2024-06-20

US20240198252A1

Performing operations; transporting

VAPOR RECOVERY SYSTEM FOR IMMERSION COOLED DATA CENTERS

#9 | 2023-10-26

US20230345673A1

Electricity

3-D structured two-phase cooling boilers with nano structured boiling enhancement coating

#10 | 2023-10-26

US20230341910A1

Physics

3-D structured two-phase microfluidic cooling with nano structured boiling enhancement coating

#11 | 2023-10-26

US20230338948A1

Performing operations; transporting

3D INTEGRATED CHIPS WITH MICROFLUIDIC COOLING

#12 | 2023-06-15

US20230189478A1

Electricity

SYSTEMS AND METHODS FOR TWO-PHASE COOLING OF ELECTRONIC COMPONENTS

#13 | 2023-05-18

US20230156960A1

Electricity

Systems and methods for thermal management of high-capacity devices in immersion-cooled datacenters

#14 | 2023-05-18

US20230152369A1

Physics

MODULAR AND ADJUSTABLE THERMAL LOAD TEST VEHICLE

#15 | 2022-12-22

US20220408587A1

Electricity

SYSTEMS AND METHODS FOR IMMERSION-COOLED COMPUTERS

#16 | 2022-11-03

US20220354026A1

Electricity

Computer cooling

#17 | 2022-11-03

US20220354025A1

Electricity

Liquid pumping units, and related systems and methods

#18 | 2021-11-11

US20210352830A1

Electricity

Liquid pumping units, and related systems and methods

InventorID:

5241348 ⎘