Eiji DEJIMA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2022-11-17

Top Assignees for applications by Eiji DEJIMA

The entities that hold a legal rights for patent applications filed by inventor DEJIMA Eiji:

MITSUBISHI CHEMICAL CORPORATION 3 Tokyo, Japan

Recent patent applications by DEJIMA Eiji

Eiji DEJIMA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-11-17

US20220363554A1

Chemistry; metallurgy

SILICA PARTICLE, SILICA SOL, POLISHING COMPOSITION, POLISHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR WAFER, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

#2 | 2021-12-09

US20210380844A1

Chemistry; metallurgy

Silica particle and production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer and method for producing semiconductor device

#3 | 2021-12-02

US20210375631A1

Electricity

Silica particle and production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer and method for producing semiconductor device

InventorID:

5259461 ⎘