Taipei
Taiwan
21
2024-11-14
The entities that hold a legal rights for patent applications filed by inventor CHEN Eugene I-Chun:
Eugene I-Chun CHEN from Taipei, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
THIN FILM TRANSFER USING SUBSTRATE WITH ETCH STOP LAYER AND DIFFUSION BARRIER LAYER
#2 | 2024-10-03MULTI-FUNCTION SUBSTRATE
#3 | 2024-06-20IN-SITU CAP FOR GERMANIUM PHOTODETECTOR
#4 | 2024-03-21PHOTONIC SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING THE PHOTONIC SOI SUBSTRATE
#5 | 2023-12-07SURFACE UNIFORMITY CONTROL IN PIXEL STRUCTURES OF IMAGE SENSORS
#6 | 2023-11-16Thin Film Transfer Using Substrate with Etch Stop Layer and Diffusion Barrier Layer
#7 | 2023-11-16METHOD FOR FORMING AN IMAGE SENSOR
#8 | 2023-09-21Semiconductor device comprising a photodetector with reduced dark current
#9 | 2023-03-02Method for forming SOI substrate
#10 | 2023-02-02IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE
#11 | 2023-01-26DOPED SEMICONDUCTOR STRUCTURE FOR NIR SENSORS
#12 | 2022-11-03Multi-function substrate
#13 | 2022-10-13Method for forming an image sensor
#14 | 2022-06-16Multi-function substrate
#15 | 2022-06-02Method for manufacturing reflective structure
#16 | 2022-04-28In-situ cap for germanium photodetector
#17 | 2022-01-27Thin film transfer using substrate with etch stop layer and diffusion barrier layer
#18 | 2021-12-02SURFACE UNIFORMITY CONTROL IN PIXEL STRUCTURES OF IMAGE SENSORS
#19 | 2021-07-01Semiconductor structure
#20 | 2021-05-06Semiconductor device comprising a photodetector with reduced dark current
#21 | 2021-04-01Method for forming an image sensor
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