Thomas Riepl

City:

Munich

Country:

Germany

Published Applications:

Last publication date:

2024-09-05

Top Assignees for applications by Thomas Riepl

The entities that hold a legal rights for patent applications filed by inventor Riepl Thomas:

Thomas Riepl from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

SEMICONDUCTOR COMPONENT ARRANGEMENT, METHOD FOR FABRICATION THEREOF AND HEAT DISSIPATION DEVICE

Semiconductor component arrangement, method for fabrication thereof and heat dissipation device

Apparatus and method for establishing an electrically conductive connection between two substrates

Semiconductor assembly

Electrical component and method for the production thereof

InventorID:

5266328 ⎘