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Inventor profile of:

Peter BAINSCHAB

City:

Munchen

Country:

Germany

Published Applications:

1

Last publication date:

2021-12-23

Recent patent applications by BAINSCHAB Peter

Peter BAINSCHAB from Munchen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-12-23

US20210395076A1

Performing operations; transporting

MICRO-ACOUSTIC WAFER-LEVEL PACKAGE AND METHOD OF MANUFACTURE

InventorID:

5274891 ⎘